By John H. Lau,Cheng Kuo Lee,C. S. Premachandran,Yu Aibin
A accomplished consultant to 3D MEMS packaging tools and solutions
Written through specialists within the box, Advanced MEMS Packaging serves as a invaluable reference for these confronted with the demanding situations created by means of the ever-increasing curiosity in MEMS units and packaging. This authoritative advisor offers state-of-the-art MEMS (microelectromechanical structures) packaging suggestions, comparable to low-temperature C2W and W2W bonding and 3D packaging.
This definitive source is helping you choose trustworthy, artistic, high-performance, powerful, and low cost packaging innovations for MEMS units. The e-book also will reduction in stimulating extra learn and improvement in electric, optical, mechanical, and thermal designs in addition to fabrics, approaches, production, checking out, and reliability. one of the subject matters explored:
- Advanced IC and MEMS packaging trends
- MEMS units, advertisement functions, and markets
- More than 360 MEMS packaging patents and 10 3D MEMS packaging designs
- TSV for 3D MEMS packaging
- MEMS wafer thinning, dicing, and handling
- Low-temperature C2C, C2W, and W2W bonding
- Reliability of RoHS-compliant MEMS packaging
- Micromachining and water bonding techniques
- Actuation mechanisms and built-in micromachining
- Bubble swap, optical change, and VOA MEMS packaging
- Bolometer and accelerameter MEMS packaging
- Bio-MEMS and biosensor MEMS packaging
- RF MEMS switches, tunable circuits, and packaging
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